Microwave heating for semiconductor nanostructure fabrication

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United States of America Patent

PATENT NO 7994027
APP PUB NO 20100068871A1
SERIAL NO

12463942

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Abstract

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The present invention grows nanostructures using a microwave heating-based sublimation-sandwich SiC polytype growth method comprising: creating a sandwich cell by placing a source wafer parallel to a substrate wafer, leaving a small gap between the source wafer and the substrate wafer; placing a microwave heating head around the sandwich cell to selectively heat the source wafer to a source wafer temperature and the substrate wafer to a substrate wafer temperature; creating a temperature gradient between the source wafer temperature and the substrate wafer temperature; sublimating Si- and C-containing species from the source wafer, producing Si- and C-containing vapor species; converting the Si- and C-containing vapor species into liquid metallic alloy nanodroplets by allowing the metalized substrate wafer to absorb the Si- and C-containing vapor species; and growing nanostructures on the substrate wafer once the alloy droplets reach a saturation point for SiC. The substrate wafer may be coated with a thin metallic film, metal nanoparticles, and/or a catalyst.

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Patent Owner(s)

Patent OwnerAddress
GEORGE MASON INTELLECTUAL PROPERTIES INC4400 UNIVERSITY DRIVE MSN 5G5 FAIRFAX VA 22030

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Davydov, Albert V North Potomac, US 9 73
Mulpuri, Rao V Fairfax Station, US 4 28
Sundaresan, Siddharth G Vienna, US 1 1
Tian, Yonglai Fairfax, US 7 85

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