Method of adhering a pair of members
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United States of America Patent
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Aug 9, 2011
Grant Date -
Jan 1, 2009
app pub date -
Jan 22, 2007
filing date -
Jan 20, 2006
priority date (Note) -
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Abstract
A connecting structure of PCB using an anisotropic conductive film according to the present invention having members connected to each other by heat-compression using the anisotropic conductive film including an insulating adhesive as a base material and conductive particles dispersed in the insulating adhesive, wherein at least any one of the members has a flexible property, and a surface roughness value (Ra) of the member having a flexible property is 0.1 to 5.0 μm due to dents formed by heat-compression.
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