Method for interconnecting tracks present on opposite sides of a substrate
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United States of America Patent
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Aug 9, 2011
Grant Date -
Dec 11, 2008
app pub date -
Dec 5, 2006
filing date -
Dec 13, 2005
priority date (Note) -
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Abstract
A method and device for making an electrically conductive connection between two electrically conductive tracks present on two opposite sides of a dielectric substrate. The method: a) provides the substrate, with at least one first electrically conductive track present on one side thereof and at least one second electrically conductive track present on the other side of the substrate opposite the one side, b) forms a through hole through the substrate and through two opposite parts of a first track and a second track, respectively, and c) makes an electrically conductive connection via the through hole between the first track through which the through hole has been formed and the second hole through which the through hole has been formed.
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