Redistribution layer enhancement to improve reliability of wafer level packaging
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United States of America
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Aug 2, 2011
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app pub date -
Nov 10, 2009
filing date -
Nov 10, 2009
priority date (Note) -
Withdrawn
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Abstract
An enhanced redistribution layer is provided that geometrically expands redistribution layer (RDL) pads associated with a ball grid array of a wafer level package (WLP) to provide tensile stress relief during temperature cycle and/or drop testing of the WLP.
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