Resin composite copper foil, printed wiring board, and production processes thereof
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United States of America Patent
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Aug 2, 2011
Grant Date -
Jul 26, 2007
app pub date -
Jan 25, 2007
filing date -
Jan 25, 2006
priority date (Note) -
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Abstract
A resin composite copper foil comprising a copper foil and a resin layer containing a block copolymer polyimide and a maleimide compound, the resin layer being formed on one surface of the copper foil, a production process thereof, a copper-clad laminate using the resin composite copper foil, a production process of a printed wiring board using the copper-clad laminate, and a printed wiring board obtained by the above process.
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