Compact distributed ladder attenuator
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United States of America Patent
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Jul 26, 2011
Grant Date -
Mar 18, 2010
app pub date -
Sep 12, 2008
filing date -
Sep 12, 2008
priority date (Note) -
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Abstract
Simple and compact structures for an attenuator or resistor ladder can be implemented in a standard integrated circuit process as well as hybrid, thick or thin film ceramic processes, which allows metallization along with resistive components. The structure has the mathematical property that it attenuates an applied reference voltage logarithmically/exponentially along its length because of the natural solution of the Laplace equation for this type of geometry and contact configuration.
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