Semiconductor device
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United States of America Patent
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Jul 19, 2011
Grant Date -
Feb 8, 2007
app pub date -
Jun 21, 2006
filing date -
Jun 24, 2005
priority date (Note) -
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Abstract
In a semiconductor device provided with terminals for external connection, input terminals, power supply terminals and ground terminals are disposed close together on part of one edge portion of two opposing edge portions. Output terminals are disposed in the vicinity of both ends of the one edge portion and on another edge portion of the two edge portions. A ground wiring is routed from the other edge portion and connected to the ground terminals. In so doing, elemental devices connected to the input terminals are disposed close together, whereby needless gaps do not arise between the elemental devices. A ground potential is also supplied by the ground wiring.
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