Adhesive chuck and substrate bonding apparatus
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United States of America Patent
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Jul 19, 2011
Grant Date -
Mar 12, 2009
app pub date -
Jun 3, 2008
filing date -
Sep 12, 2007
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Abstract
A substrate bonding apparatus includes a first chamber including a first surface plate on which a first substrate is supported, a second chamber spaced from the first chamber and including a second surface plate on which a second substrate to be bonded to the first substrate is supported, an adhesive module provided on the first surface plate and including a plurality of adhesive rubber areas holding the first substrate, and a lift module for lifting at least one of the plurality of adhesive rubber areas.
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