Semiconductor device and multilayer wiring board
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United States of America Patent
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Jul 12, 2011
Grant Date -
Nov 19, 2009
app pub date -
Aug 24, 2007
filing date -
Aug 28, 2006
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A gas or an insulating material having a relative dielectric constant of not more than 2.5 on average is interposed between a first wiring layer and a second wiring layer included in a multilayer wiring structure. Between a wiring of the first wiring layer and a wiring of the second wiring layer, a conductive connector is arranged. Between a predetermined wiring of the first wiring layer and a predetermined wiring of the second wiring layer, an insulating heat conductor having a relative dielectric constant of not more than 5 is arranged.
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