Contact structure having a compliant bump and a testing area
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United States of America Patent
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Jul 12, 2011
Grant Date -
Jan 31, 2008
app pub date -
Nov 24, 2006
filing date -
Jul 28, 2006
priority date (Note) -
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Abstract
A contact structure having both a compliant bump and a testing area and a manufacturing method for the same is introduced. The compliant bump is formed on a conductive contact of the silicon wafer or a printed circuit board. The core of the bump is made of polymeric material, and coated with a conductive material. In particular, the compliant bump is disposed on the one side of the conductive contact structure that includes both the bump and the testing area, wherein the testing area allows the area to be functionality tested, so as to prevent damage of the coated conductive material over the compliant bump during a probe testing.
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