Laser ablation using multiple wavelengths
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United States of America Patent
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Jul 12, 2011
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N/A
app pub date -
Mar 19, 2008
filing date -
Mar 21, 2007
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Abstract
In laser micromachining and laser defect repair of a first material, a first set of one or more laser wavelengths is selected in accordance with the first material's absorption characteristics and is combined and delivered concurrently with a second set of one or more laser wavelengths which is selected in accordance with the absorption characteristics of a second material generated by and remaining from the ablating interaction of the first material with the first set of laser wavelengths. The concurrent presence of the second set of one or more laser wavelengths removes the residual second material.
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