Substrate-free light emitting diode

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United States of America Patent

PATENT NO 7973330
APP PUB NO 20090283750A1
SERIAL NO

12510255

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Abstract

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A substrate-free light emitting diode (LED) including an epitaxy layer, a conductive supporting layer, and a first contact pad is provided. The epitaxy layer includes a first type doped semiconductor layer, a light emitting layer, and a second type doped semiconductor layer. The light emitting layer is disposed on the first type doped semiconductor layer, and a portion of the first type doped semiconductor layer is exposed. The second type doped semiconductor layer and the conductive supporting layer are sequentially disposed on the second type doped semiconductor layer. The first contact pad is disposed on the exposed first type doped semiconductor layer and electrically connected thereto. The first contact pad and the conductive supporting layer serving as an electrode are disposed on the same side of the epitaxy layer to avoid the light shielding effects of the electrode to improve the front light emitting efficiency of the LED.

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Patent Owner(s)

Patent OwnerAddress
WALSIN LIHWA CORPORATIONNO 566-3 GAOSHI RD YANGMEI CITY TAOYUAN COUNTY 326

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hsiao, Zhi-Cheng Changhua County, TW 10 38
Hsieh, Gen-Wen Taipei County, TW 3 4
Yang, Chien-Cheng Taipei County, TW 20 162

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