Process for producing microsphere with use of metal substrate having through-hole

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Jul 5, 2011
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Mar 13, 2008
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Oct 11, 2005
filing date
Oct 18, 2004

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of 1 to 1/30 is a metal substrate.

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Patent Owner(s)

Patent Owner	Address
KURARAY CO LTD	KURASHIKI-SHI OKAYAMA 710-0801
NATIONAL AGRICULTURE AND FOOD RESEARCH ORGANIZATION	TSUKUBA-SHI IBARAKI 305-8517
MITSUTOSHI NAKAJIMA	1-17-11 KANNONDAI TSUKUBA-SHI IBARAKI 305-0856

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B29B:PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE ....

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Inventor Name	Address	# of filed Patents	Total Citations
Fukuda, Motohiro	Ibaraki, JP	28	299
Kanai, Seiichi	Ibaraki, JP	3	46
Kitani, Takenori	Ibaraki, JP	6	70
Nakajima, Mitsutoshi	Ibaraki, JP	16	468
Nishi, Taiji	Tokyo, JP	14	119

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Process for producing microsphere with use of metal substrate having through-hole

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United States of America Patent

11577474

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PATENT NO	7972543
APP PUB NO	20080061459A1
SERIAL NO	11577474
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
July 05, 2011	US,7972543,B2 US7972543B2	GRANTED PATENT AS SECOND PUBLICATION
March 13, 2008	US,20080061459,A1 US20080061459A1	FIRST PUBLISHED PATENT APPLICATION

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11577474

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