Hole inspection apparatus and hole inspection method using the same
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United States of America Patent
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Jun 28, 2011
Grant Date -
Jun 18, 2009
app pub date -
Apr 3, 2007
filing date -
Apr 3, 2006
priority date (Note) -
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Abstract
Disclosed herein is an apparatus and method for inspecting the via holes of a semiconductor device using electron beams. The apparatus includes electron beam irradiation means, a current measuring means, and a current measuring means and data processing means. The electron beam irradiation means radiate respective electron beams to inspect a plurality of inspection target holes. The current measuring means measures current, which is generated by irradiating the electron beams, radiated from the electron beam irradiation means, through a conductive layer located under the holes, or through the conductive layer and a separate detector. The data processing means processes data acquired through the measurement of the current measuring means.
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