Method of joining chips utilizing copper pillar
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Sep 20, 2011
Grant Date -
Sep 18, 2008
app pub date -
May 29, 2008
filing date -
May 29, 2008
priority date (Note) -
Withdrawn
status (Latency Note)
Importance
Loading Importance Indicators... 
Abstract
A copper pillar may be provided on a chip and a first tin-containing layer may be provided over the copper pillar. A second tin-containing layer may be provided on a substrate. The first tin-containing layer may be joined with the second tin-containing layer during a packaging process.
Loading the Abstract Image...
OK
First Claim
Family
Loading Family data...
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully