Semiconductor chip, method of fabricating the same and stacked package having the same
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United States of America Patent
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Jun 21, 2011
Grant Date -
Feb 19, 2009
app pub date -
Aug 14, 2008
filing date -
Aug 16, 2007
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A semiconductor chip, a method of fabricating the same and a stacked package having the same are disclosed. The semiconductor chip includes a wafer, a semiconductor device disposed on the wafer, an insulating layer covering the semiconductor device and disposed on the wafer, a deep via formed to penetrate the wafer and the insulating layer, and a heat dissipation member spaced at a predetermined interval from the deep via and penetrating at least a portion of the insulating layer for dissipating heat generated by the deep via.
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