Recycling faulty multi-die packages
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United States of America Patent
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Jun 21, 2011
Grant Date -
Oct 22, 2009
app pub date -
Jun 18, 2009
filing date -
Jan 11, 2006
priority date (Note) -
Expired
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Abstract
The present invention teaches the recycling of a faulty multi-die memory package by isolating the functional part of the package and using it as a smaller memory package.
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