Holding/convey jig and holding/convey method
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United States of America Patent
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Jun 21, 2011
Grant Date -
Jun 1, 2006
app pub date -
Jul 15, 2003
filing date -
Nov 1, 2002
priority date (Note) -
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status (Latency Note)
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Abstract
A jig for holding and conveyance includes a plate having a weak-adherence adhesive pattern on a surface and a printed circuit board having a conductive portion and a non-conductive portion on the surface of an insulating substrate. The weak-adherence adhesive pattern is formed at a position corresponding to the non-conductive portion. Alternatively, the weak-adherence adhesive pattern subjected to surface roughening is formed on a surface of the weak-adhesive layer at a position corresponding to the conductive portion.
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