Deformable thermal pads for optical fibers
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United States of America Patent
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Jun 7, 2011
Grant Date -
Mar 25, 2010
app pub date -
Sep 19, 2008
filing date -
Sep 19, 2008
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A system for fiber optic packaging includes a first substrate and a first deformable pad coupled to the first substrate. The first deformable pad is characterized by a thermal conductivity greater than 1 W/mK. The system also includes a fiber coil having at least a portion embedded in the first deformable pad to provide physical contact between the at least a portion of the fiber coil and the first deformable pad. The system further includes a second substrate coupled to the fiber coil and at least a portion of the first deformable pad.
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