Microchannel cooler for high efficiency laser diode heat extraction
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United States of America Patent
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Jun 7, 2011
Grant Date -
Mar 25, 2010
app pub date -
Dec 1, 2009
filing date -
Jul 26, 2006
priority date (Note) -
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Abstract
A laser diode package includes a laser diode, a cooler, and a metallization layer. The laser diode is used for converting electrical energy to optical energy. The cooler receives and routes a coolant from a cooling source via internal channels. The cooler includes a plurality of ceramic sheets and a highly thermally-conductive sheet. The ceramic sheets are fused together and the thermally-conductive sheet is attached to a top ceramic sheet of the plurality of ceramic sheets. The metallization layer has at least a portion on the thermally-conductive sheet. The portion is electrically coupled to the laser diode for conducting the electrical energy to the laser diode.
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