Alloy for heat dissipation of semiconductor device and semiconductor module, and method of manufacturing alloy

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United States of America Patent

PATENT NO 7955448
APP PUB NO 20090053090A1
SERIAL NO

11886973

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Abstract

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in a Cu matrix except Cr phases of more than 100 nm.

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Patent Owner(s)

Patent OwnerAddress
JFE STEEL CORPORATION2-3 UCHISAIWAI-CHO 2-CHOME CHIYODA-KU TOKYO 100-0011
JFE PRECISION CORPORATION2-3 KAMIOSE-CHO NIIGATA-SHI NIIGATA 950-0063

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kobiki, Hideaki Tokyo, JP 10 23
Terao, Hoshiaki Niigata, JP 9 44
Uenosono, Satoshi Tokyo, JP 41 359

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