Lead frame, semiconductor package including the lead frame and method of forming the lead frame
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United States of America Patent
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May 31, 2011
Grant Date -
Jan 15, 2009
app pub date -
Jul 2, 2008
filing date -
Jul 9, 2007
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Provided are a lead frame and a semiconductor package including the same. The lead frame includes a first lead frame portion including a plurality of first leads; an adhesive member disposed such that the first leads are adhered to one surface of the adhesive member; and a second lead frame portion including a plurality of second leads disposed such that the second leads are adhered to the other surface of the adhesive member, wherein the second leads are arranged so as not to overlap with the first leads. The lead frame may optionally include a die pad on which a semiconductor chip is installed.
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