Method for producing a thin semiconductor chip comprising an integrated circuit
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United States of America Patent
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May 31, 2011
Grant Date -
Apr 16, 2009
app pub date -
Sep 11, 2008
filing date -
Mar 14, 2006
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Abstract
In a method for producing a thin film chip including an integrated circuit, a semi-conductor wafer having a first surface is provided. At least one cavity is produced under a defined section of the first surface by means of porous silicon. A circuit structure is produced in the defined section. The defined wafer section is subsequently released from the semiconductor wafer by severing local web-like connections, which hold the wafer section above the cavity and on the remaining semiconductor wafer.
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