Process for fabricating crown capacitors of dram and capacitor structure

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7951668
APP PUB NO 20100177459A1
SERIAL NO

12353260

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Abstract

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A process for fabricating crown capacitors is described. A substrate having a template layer thereon is provided. A patterned support layer is formed over the template layer. A sacrifice layer is formed over the substrate covering the patterned support layer. Holes are formed through the sacrifice layer, the patterned support layer and the template layer, wherein the patterned support layer is located at a depth at which bowing of the sidewalls of the holes occurs and is bowed less than the sacrifice layer at the sidewalls. A substantially conformal conductive layer is formed over the substrate. The conductive layer is then divided into lower electrodes of the crown capacitors.

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Patent Owner(s)

Patent OwnerAddress
POWERCHIP SEMICONDUCTOR MANUFACTURING CORPORATIONNO 18 LI-HSIN RD 1 HSINCHU SCIENCE PARK HSINCHU

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Wu, Kun-Jung Taoyuan County, TW 16 53
Yukihiro, Nagai Hsinchu, TW 1 10

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