Vapor deposition of a layer
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United States of America Patent
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May 31, 2011
Grant Date -
Oct 25, 2007
app pub date -
Apr 20, 2006
filing date -
Apr 20, 2006
priority date (Note) -
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Abstract
A method of depositing a layer onto a substrate, comprising heating an evaporator to a temperature capable of completely evaporating the evaporant to be deposited, dispensing into the evaporator one or more quantized units of the evaporant where the evaporant is completely vaporized, providing an area vapor dispenser having a plurality of apertures, and directing the vaporized evaporant from the evaporator to the area vapor dispenser so that the evaporant is dispensed through the apertures to deposit the layer on the substrate.
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