Cleaning formulation for removing residues on surfaces

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7947637
APP PUB NO 20080004197A1
SERIAL NO

11770382

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Abstract

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The present disclosure provides a non-corrosive cleaning composition that is useful for removing residues from a semiconductor substrate. The composition can comprise water, at least one hydrazinocarboxylic acid ester, at least one water soluble carboxylic acid, optionally, at least one fluoride-containing compound, and, optionally, at least one corrosion inhibitor not containing a carboxyl group. The present disclosure also provides a method of cleaning residues from a semiconductor substrate using the non-corrosive cleaning composition.

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Patent Owner(s)

Patent OwnerAddress
FUJIFILM ELECTRONIC MATERIALS U S A INC80 CIRCUIT DRIVE NORTH KINGSTOWN RI 02852

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kneer, Emil Mesa, US 4 58

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