Process for the wet-chemical treatment of one side of silicon wafers

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May 17, 2011
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Sep 25, 2008
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Mar 22, 2004
filing date
Mar 22, 2004

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Abstract

The present invention relates in general terms to the treatment or processing of substrate surfaces. In particular, the invention relates to processes for modifying the surface of silicon wafers.

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Patent Owner	Address
RENA TECHNOLOGIES GMBH	78148 GÜTENBACH

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H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....

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Inventor Name	Address	# of filed Patents	Total Citations
Delahaye, Franck	Vörstetten, DE	3	6

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Process for the wet-chemical treatment of one side of silicon wafers

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United States of America Patent

10599208

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PATENT NO	7943526
APP PUB NO	20080233760A1
SERIAL NO	10599208
DOCKET NO

US Family Size	Non-US Coverage
Patent Longevity	Forward Citations

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
May 17, 2011	US,7943526,B2 US7943526B2	GRANTED PATENT AS SECOND PUBLICATION
September 25, 2008	US,20080233760,A1 US20080233760A1	FIRST PUBLISHED PATENT APPLICATION

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10599208

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