Layered panel structure including self-bonded layers of thermoformable and non-thermoformable materials

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United States of America Patent

PATENT NO 7943232
APP PUB NO 20100255283A1
SERIAL NO

12802679

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Abstract

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A layered panel structure including first and second layers formed, respectively, of (a) non-thermoformable, and (b) thermoformable, fiber-strand-reinforced resin, materials, having therebetween a bonding interface formed by resin drawn from the second layer.

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Patent Owner(s)

Patent OwnerAddress
HIGH IMPACT TECHNOLOGY L L C9900 S W TIGARD STREET TIGARD OR 97223

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hicks, Lance A Salem, US 12 19
Monk, Russell A Salem, US 58 375

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