Cover incorporating a radiofrequency identification device
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United States of America Patent
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May 10, 2011
Grant Date -
Nov 11, 2010
app pub date -
Jul 15, 2010
filing date -
Apr 26, 2001
priority date (Note) -
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status (Latency Note)
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Abstract
The invention relates to a multilayer structure such as a cover paper for a booklet, in particular a passport. The structure includes a radiofrequency identification device having a chip which is received in the thickness of the multilayer structure without generating extra thickness, the materials constituting the various layers of the multilayer structure are selected, as are the thicknesses of said layers, in such a manner that the cover withstands mechanical and thermal shocks, and in particular is capable of being subjected to graining treatment, and/or to decoration treatment by depositing a film by hot transfer under pressure, and/or to lamination treatment while depositing security films.
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