Substrate processing apparatus
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United States of America Patent
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May 10, 2011
Grant Date -
Oct 18, 2007
app pub date -
Feb 7, 2007
filing date -
Feb 7, 2006
priority date (Note) -
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Abstract
A substrate processing apparatus of the present invention is to apply processing using a processing liquid to a substrate. The substrate processing apparatus includes a first-side plate disposed oppositely to a first surface of the substrate with a distance and provided with plural discharge ports and suction ports in a surface opposing the first surface, a first-side processing liquid supply mechanism that supplies a processing liquid to the discharge ports in the first-side plate, and a first-side suction mechanism that sucks insides of the suction ports in the first-side plate.
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