Imprinting of partial fields at the edge of the wafer

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United States of America Patent

PATENT NO 7935292
APP PUB NO 20090283934A1
SERIAL NO

12479437

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Abstract

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Edge field patterning of a substrate having full fields and partial fields may include patterning using a template having multiple mesas with each mesa corresponding to a field on the substrate. Polymerizable material may be deposited solely between the template and the full fields of the substrate. A non-reactive material may be deposited between the template and partial fields of the substrate.

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Patent Owner(s)

Patent OwnerAddress
CITIBANK N A388 GREENWICH STREET NEW YORK NY 10013

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Choi, Byung-Jin Austin, US 194 2163
Sreenivasan, Sidlgata V Austin, US 214 5594

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