Electrical connecting structure and bonding structure
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United States of America Patent
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Apr 26, 2011
Grant Date -
Aug 13, 2009
app pub date -
May 30, 2008
filing date -
Feb 12, 2008
priority date (Note) -
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Abstract
An electrical connecting structure including a conductive pad, a polymer bump and a patterned conductive layer is provided. The conductive pad is on a substrate and the polymer bump is disposed over the substrate. The patterned conductive layer is disposed on the polymer bump and electrically connects to the conductive pad, wherein the patterned conductive layer covers a portion of the polymer bump and exposes another portion of the polymer bump.
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