Integrated circuit structure having bottle-shaped isolation
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United States of America Patent
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Apr 26, 2011
Grant Date -
Feb 18, 2010
app pub date -
Aug 18, 2008
filing date -
Aug 18, 2008
priority date (Note) -
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Abstract
An integrated circuit structure comprises a semiconductor substrate, a device region positioned in the semiconductor substrate, an insulating region adjacent to the device region, an isolation structure positioned in the insulating region and including a bottle portion and a neck portion filled with a dielectric material, and a dielectric layer sandwiched between the device region and the insulation region.
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