Method and apparatus for determining the stability of an electroless plating bath
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United States of America Patent
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Apr 26, 2011
Grant Date -
Feb 11, 2010
app pub date -
Aug 7, 2008
filing date -
Aug 7, 2008
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Abstract
The stability of an electroless plating bath for depositing a metal (e.g., nickel) is determined by titrating a sample of the plating bath with a titrant comprising ions of a catalytic metal (e.g., palladium) and detecting hydrogen released at the titration endpoint. The quantity of titrant required to attain the endpoint provides a measure of the stability of the electroless plating bath.
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