Method of enabling selective area plating on a substrate
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United States of America Patent
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Apr 12, 2011
Grant Date -
Mar 26, 2009
app pub date -
Sep 26, 2007
filing date -
Sep 26, 2007
priority date (Note) -
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Abstract
A method of enabling selective area plating on a substrate includes forming a first electrically conductive layer (310) over substantially all of the substrate, covering sections of the first electrically conductive layer with a mask (410) such that the first electrically conductive layer has a masked portion and an unmasked portion, forming a second electrically conductive layer (710, 1210), the second electrically conductive layer forming only over the unmasked portion of the first electrically conductive layer, and removing the mask and the masked portion of the first electrically conductive layer. In an embodiment, the mask covering sections of the first electrically conductive layer is a non-electrically conductive substance (1010) applied with a stamp (1020). In an embodiment, the mask is a black oxide layer.
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