Pattern forming apparatus and manufacturing apparatus using the same

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United States of America Patent

PATENT NO 7921799
APP PUB NO 20070166850A1
SERIAL NO

11443295

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Abstract

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, where a solvent is sprayed from a solvent spray nozzle of the surface treatment system to surface of a glass substrate where a bus line pattern groove is formed. The ink is discharged from an ink discharge nozzle of the ink jet system into the groove of bus line pattern on a glass substrate, and a bus line pattern is formed.

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Patent Owner(s)

Patent OwnerAddress
FUTURE VISION INC3RD FLOOR HAKUA BLDG 2-4-1 AKASAKA MINATO-KU TOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kobayashi, Yosuke Sendai, JP 82 897
Takemura, Fumitaka Higashichikuma, JP 2 20
Tanaka, Tsutomu Sendai, JP 399 11273
Yamazaki, Tomoe Sendai, JP 1 0

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