Integrated circuit (IC) carrier assembly with first and second suspension means
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 5, 2011
Grant Date -
Mar 5, 2009
app pub date -
Nov 4, 2008
filing date -
Oct 20, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An integrated circuit (IC) carrier assembly comprises a printed circuit board (PCB), a carrier soldered to the PCB, the carrier comprising a plurality of electrical contact islands surrounding a receiving zone for receiving an IC, a first resilient suspension means interconnecting pairs of adjacent islands, and a second resilient suspension means connecting the islands adjacent to the receiving zone with the receiving zone.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully