Laser crystallization method for amorphous semiconductor thin film

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United States of America Patent

PATENT NO 7919366
APP PUB NO 20100093182A1
SERIAL NO

12576938

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Abstract

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A laser crystallization method in which an amorphous silicon thin film 2 formed on a substrate 1 is irradiated with a laser beam, the method including the steps of providing the amorphous silicon thin film 2 with an absorbent to form an absorbent layer 3 on the desired specific local areas of the amorphous silicon thin film 2 and laser annealing for crystallizing the specific local areas of the amorphous silicon thin film 2 by irradiating the amorphous silicon thin film 2 including the specific local areas with a semiconductor laser beam L having a specific wavelength absorbable by the absorbent layer 3 and unabsorbable by the amorphous silicon thin film 2 for heating the absorbent layer 3.

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Patent Owner(s)

Patent OwnerAddress
OSAKA UNIVERSITY1-1 YAMADAOKA SUITA-SHI OSAKA 5650871
THE JAPAN STEEL WORKS LTD11 1 OSAKI 1 CHOME SHINAGAWA KU TOKYO 141-0032

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Goto, Tatsumi Kanagawa, JP 2 4
Inami, Toshio Kanagawa, JP 6 57
Jitsuno, Takahisa Osaka, JP 6 17
Kusama, Hideaki Kanagawa, JP 4 55
Togashi, Ryotaro Kanagawa, JP 2 15
Tokumura, Keiu Osaka, JP 4 10

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