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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
SHIBAURA MECHATRONICS CORPORATION	5-1 KASAMA 2-CHOME SAKAE-KU YOKOHAMA-SHI KANAGAWA 247-8610

International Classification(s)

• B29C:SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTAN....
• B31F:MECHANICAL WORKING OR DEFORMATION OF PAPER OR CARD....
• B27G:ACCESSORY MACHINES OR APPARATUS; TOOLS
• B32B:LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA....

• [Classification Symbol]

• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Nishigaki, Hisashi	Yokohama, JP	11	75
Takeuchi, Hachiya	Yokohama, JP	2	3
Tanabe, Shohei	Yokohama, JP	5	1

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
March 29, 2011	US,7913737,B2   US7913737B2	GRANTED PATENT AS SECOND PUBLICATION
November 29, 2007	US,20070272351,A1   US20070272351A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent No: 7913737

Bonding apparatus and bonding method

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