Light emitting diode package
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United States of America Patent
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Mar 22, 2011
Grant Date -
Dec 17, 2009
app pub date -
Jun 12, 2009
filing date -
Jun 12, 2008
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A light emitting diode package is provided including: a lead frame that includes an electrode pad and an electrode lead that are integrally formed to each other; and a housing, wherein the electrode pad is exposed in a first direction through a window formed by inner walls of the housing, and the electrode lead is exposed in a second direction through a through-hole, wherein the housing includes a step jaw prepared by sinking the housing inner walls.
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