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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
NITTO DENKO CORPORATION	IBARAKI-SHI OSAKA 567-8680

International Classification(s)

• C08J:WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTE....
• C09K:MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED ....
• C08F:MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONL....
• G03C:PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES....

• 2008 Application Filing Year
• C08J Class
• 604 Applications Filed
• 342 Patents Issued To-Date
• 56.63 % Issued To-Date

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Fujii, Hirofumi	Ibaraki, JP	99	1066
# of filed Patents : 99 Total Citations : 1066
Hirashima, Katsutoshi	Ibaraki, JP	5	27
# of filed Patents : 5 Total Citations : 27
Jo, Kyouyuu	Ibaraki, JP	7	34
# of filed Patents : 7 Total Citations : 34
Mizutani, Masaki	Ibaraki, JP	85	979
# of filed Patents : 85 Total Citations : 979

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Patent Citation Ranking

• 4 Citation Count
• C08J Class

• 6.08 % this patent is cited more than
• 14 Age

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
March 22, 2011	US,7910631,B2   US7910631B2	GRANTED PATENT AS SECOND PUBLICATION
April 23, 2009	US,20090101394,A1   US20090101394A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent No: 7910631

Photosensitive resin composition and flexible printed wiring circuit board having insulative cover layer formed of photosensitive resin composition

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Abstract

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A photosensitive resin composition which is excellent in flame resistance, resolution and flexibility, and substantially free from deposition of components thereof to prevent contamination of a product. The photosensitive resin composition comprises:(A) a cyclic phosphazene compound represented by the following general formula (1):wherein at least one of the Rs is an organic group having the urethane(meth)acrylate structure represented by the following general formula (2) and n is a positive number of 2 to 5:wherein the cyclic phosphazene compound (A) is present in a proportion of 5 to 30 wt % based on the total weight of the composition.

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Description

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Claims

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Legal Events

 

• LAPS2019
• STCH2019
• FP2019
• FEPP2018
• FPAY2014
• I2011
• STCF2011
• FEPP2010
• P2009
• F2008
• AS2008
• PD2007

Date	Code	Event	Description
Apr 29, 2019	LAPS	LAPSE FOR FAILURE TO PAY MAINTENANCE FEES	free format text: PATENT EXPIRED FOR FAILURE TO PAY MAINTENANCE FEES (ORIGINAL EVENT CODE: EXP.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY
Apr 29, 2019	STCH	INFORMATION ON STATUS: PATENT DISCONTINUATION	free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362
Mar 22, 2019	FP	LAPSED DUE TO FAILURE TO PAY MAINTENANCE FEE	Effective Date: Mar 22, 2019
Nov 12, 2018	FEPP	FEE PAYMENT PROCEDURE	free format text: MAINTENANCE FEE REMINDER MAILED (ORIGINAL EVENT CODE: REM.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY
Aug 27, 2014	FPAY	FEE PAYMENT	year of fee payment: 4
Mar 22, 2011	I	Issuance
Mar 02, 2011	STCF	INFORMATION ON STATUS: PATENT GRANT	free format text: PATENTED CASE
Dec 08, 2010	FEPP	FEE PAYMENT PROCEDURE	free format text: PAYOR NUMBER ASSIGNED (ORIGINAL EVENT CODE: ASPN); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY
Apr 23, 2009	P	Published
Oct 16, 2008	F	Filing
Oct 07, 2008	AS	ASSIGNMENT	free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:FUJII, HIROFUMI;HIRASHIMA, KATSUTOSHI;MIZUTANI, MASAKI;AND OTHERS;REEL/FRAME:021697/0572 Owner name: NITTO DENKO CORPORATION, JAPAN Effective Date: Oct 07, 2008
Oct 17, 2007	PD	Priority Date