Lithographic process
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United States of America Patent
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Mar 22, 2011
Grant Date -
Oct 2, 2008
app pub date -
Dec 1, 2004
filing date -
Dec 11, 2003
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention provides a lithographic process for producing high aspect ratio parts from an epoxy-type negative photoresist comprising the steps of: (i) irradiating a prebaked masked epoxy-type negative photoresist on a substrate with light at a total energy density of from 18,000 to 35,000 mJ/cm.sup.2, (ii) post-baking the exposed photoresist at elevated temperature, and (iii) developing the exposed photoresist in a solvent, wherein no more than 15% of the energy density is contributed by light having a wavelength of 400 nm or less. The invention also discloses a reciprocating microengine (10) comprising a cylinder (14), piston (12) and crankshaft made by the process.
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