Low-energy method for fabrication of large-area sputtering targets

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United States of America Patent

PATENT NO 7910051
APP PUB NO 20080216602A1
SERIAL NO

11935099

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Abstract

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In various embodiments, large-area sputtering targets are formed by providing a plurality of sputtering targets each comprising a backing plate and a refractory metal layer disposed thereon, and spray depositing a refractory metal powder on an interface between the sputtering targets, the refractory metal powder consisting essentially of the same metal as each refractory metal layer, thereby joining the refractory metal layers of the sputtering targets.

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Patent Owner(s)

Patent OwnerAddress
H C STARCK SURFACE TECHNOLOGY AND CERAMIC POWDERS GMBHLANDSBERGER STR 98 MUENCHEN 80339

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gaydos, Mark Nashua, US 19 366
Kumar, Prabhat Framingham, US 94 1335
Miller, Steve A Canton, US 1 30
Zimmermann, Stefan Laufenburg, DE 59 707

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  • 30 Citation Count
  • C23C Class
  • 74.62 % this patent is cited more than
  • 14 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges383361236533241411651101 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 90100 +020406080100120140160180200220240260280300320340360

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