Solder attached contact and a method of manufacturing the same
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United States of America Patent
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-
Mar 22, 2011
Grant Date -
Dec 2, 2010
app pub date -
Oct 30, 2007
filing date -
Nov 1, 2006
priority date (Note) -
Expired
status (Latency Note)
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Abstract
There are provided the steps of preparing a contact (10, 20), which is formed from a metallic sheet including a base portion (11, 21), an elastic deformation portion (12, 22), and a contact portion (13, 23), and in which a recess (15, 25) is formed on a bottom surface of the base portion and a plurality of through-holes (16, 26, 27) are formed to be arranged above the recess and in parallel to the bottom surface of the base portion to extend through the base portion, and holding solder on the through-holes formed on the contact. A desired, solder-attached contact (10a, 20a) is fabricated by the manufacturing method. Further, the solder is a solder ball (90) and the step of holding solder includes the step of preparing the solder ball and the step of press fitting the solder ball into the through-hole.
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