Semiconductor integrated circuit package, printed circuit board, semiconductor apparatus, and power supply wiring structure
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United States of America Patent
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Mar 15, 2011
Grant Date -
Mar 19, 2009
app pub date -
Sep 4, 2008
filing date -
Sep 4, 2007
priority date (Note) -
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Abstract
A semiconductor integrated circuit package, a printed circuit board, a semiconductor apparatus, and a power supply wiring structure that allow attainment of stable power source and ground wiring without causing resonance even in a high-frequency bandwidth are provided. In an interior portion of the package, a power source wiring and a ground wiring constitute a pair wiring structure in which the power source wiring and the ground wiring are juxtaposed at a predetermined interval so as to establish electromagnetic coupling therebetween. A plurality of pair wiring structures are combined in such a manner that, when viewed in a section perpendicular to a wiring extending direction, the pair wiring assembly assumes a staggered (checkered) configuration. It is preferable that, each of the silicon chip and the printed circuit board, like the package, has pair wiring structures disposed inside.
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