Surface roughening method for light emitting diode substrate

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7901963
SERIAL NO

12018086

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

The present invention discloses a surface roughening method for an LED substrate, which uses a grinding technology and an abrasive paper of from No. 300 to No. 6000 to grind the surface of a substrate to form a plurality of irregular concave zones and convex zones on the surface of the substrate. Next, a semiconductor light emitting structure is formed on the surface of the substrate. The concave zones and convex zones can scatter and diffract the light inside LED, reduce the horizontally-propagating light between the substrate and the semiconductor layer, decrease the probability of total reflection and promote LED light extraction efficiency.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
TEKCORE CO LTDNO 18 TZU-CHUNG 3RD RD NAN-KUNG INDUSTRIAL ZONE NANTOU

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lee, Chia-Ming Yilan County, TW 34 544
Yeh, Nien-Tze Taoyuan County, TW 17 121

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation