Low-adhesion material, resin molding die, and soil resistant material
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United States of America Patent
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Mar 8, 2011
Grant Date -
Apr 30, 2009
app pub date -
Dec 27, 2006
filing date -
Apr 11, 2006
priority date (Note) -
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Abstract
having a low adhesion property with respect to a set resin, and has a thermal expansion coefficient smaller than that of the body portion. By bonding the body portion and the surface layer at a high temperature and then cooling them down, compressive residual stress is caused in the surface layer due to a difference in the thermal expansion coefficients thereof, and the compressive residual stress is present in the surface layer.
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