Structure and methods of processing for solder thermal interface materials for chip cooling
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United States of America Patent
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Mar 1, 2011
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N/A
app pub date -
Apr 30, 2007
filing date -
Apr 30, 2007
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Abstract
Assemblies for dissipating heat from integrated circuits and circuit chips are disclosed. The assemblies include a low melt solder as a thermal interface material (TIM) for the transfer of heat from a chip to a heat sink (HS), wherein the low melt solder has a melting point below the maximum operating temperature of the chip. Methods for making the assemblies are also disclosed.
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