Charge system for destroying chips on a circuit board and method for destroying chips on a circuit board
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United States of America Patent
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Mar 1, 2011
Grant Date -
Dec 18, 2008
app pub date -
Jun 15, 2007
filing date -
Jun 15, 2007
priority date (Note) -
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Abstract
A charge system for destroying chips on a circuit board is provided. The charge system has a first substrate having a number of recesses formed therein with each of the recesses having a housing disposed therein. A high density charge is disposed within the housing. A number of recesses are formed within the high density charge. A number of low density charges are disposed within each of the recesses formed within the high density charge. A second substrate is located proximate to the first substrate. The low density charge and the high density charge are structured to destroy the second substrate after ignition. A method of destroying chips is also provided.
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