Lead-free sealing material
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United States of America Patent
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Feb 22, 2011
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N/A
app pub date -
Jun 30, 2008
filing date -
May 20, 2008
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Abstract
. The lead-free sealing material has excellent chemical durability, low melting temperature, and good flowability during heating. The lead-free material is particularly suitable to be used as a sealing material. The lead-free sealing material may additionally contain low-thermal-expansion powdered fillers to reduce the thermal expansion coefficient of the resulting sealing material.
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